The research focuses on fabrication of nanostructures for semiconductor applications, reliability studies of copper interconnect systems and packaging technology.
Active areas of research include advanced semiconductor processing technologies for nanoelectronics, advanced AlGaInP and GaN lasers, packaging of microelectronic and optoelectronic components, and materials for high reliability interconnects. These research projects are aptly supported by cutting edge research facilities, such as thin film deposition and patterning, device and process characterization, IC packaging, dielectric breakdown, electromigration, etc.
Areas of Research
- Active and passive devices
- Advanced silicon processing technology
- Materials and process development for nanoelectronics