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FACILITIES: Microelectronics Materials
Lab
Location:
N4.1-B3-02
Tel: (65) 6790 6161
Contact Person:
Mastura Aidel Binte A Bakar (Ms)
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Probe Station Model No.: REL-4800
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The
lab facilitates research and academic programs
in microelectronics and optoelectronics materials,
process technology, packaging and reliability.
Much of the research and academic programs are
applications-driven, aimed at providing innovative
solutions to challenges faced by the dynamic
microelectronics industry through the development
of new materials and process technologies.
Active
areas of research include advanced semiconductor
process technologies for nano-electronics, advanced
AlGaInP & GaN Lasers, packaging of microelectronic
and optoelectronic components, and materials
for high reliability interconnects. These research
projects are aptly supported by cutting edge
research facilities such as thin film deposition
and patterning, device and process characterization,
IC packaging, dielectric breakdown and electro-migration.
Major
facilities:
Microelectronic
/ Optoelectronic Process Equipment
- Magnetron
Sputtering System
- Spin
Coater
- Laser
Direct Writer
- Wet
Chem Processing Station
- Rapid
Thermal Processing System
- Electro-plating
Station
- Pulsed
Laser Deposition system
- Pulsed
anodic oxidation system
Packaging
Equipment
- Wafer
Scriber
- Die
Bonding System
- Thermosonic
Au Wire Bonder
- Screen
Printer
- Reflow
Oven
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