Nano-Electronics & Interconnects

The nano-electronics and interconnects group focuses on research programs involved in the fabrication of nano-structures for semiconductor applications, the reliability study of copper interconnect systems and packaging technology.

Research in nano-structured materials includes materials used for the 90nm node and beyond, such as rare-earth materials for high-k gate dielectrics, polymeric ultra low-k dielectrics, and metallic nano-wires as interconnects.

Besides standard thin film deposition techniques, advanced fabrication methods such as templated assembly, self-assembly and electrostatic atomization are being studied for the development of nano-electronic devices. Integration of on-chip copper interconnects with low-k dielectrics and advanced diffusion barrier systems is actively researched.

Reliability issues of advanced copper-based interconnect systems such as electromigration, stress migration and dielectric breakdown are also actively investigated. Performance characterization, modeling and research in advanced packaging technologies complement the research in the areas of optoelectronic devices.

The research group collaborates actively with Chartered Semiconductor Manufacturing, Hynix Semiconductor, AMR Technologies Inc. (Canada), the Institute of Microelectronics, the Institute of Materials Research and Engineering, and University of California Los Angeles (UCLA).

Areas Of Research :

• Nano-structured Interconnect Materials
• Materials & Process Development for Nano-electronics
• Advanced Silicon Process Technology
• Process Integration & Reliability
• Semiconductor Devices & Packaging
• Active & Passive Devices
• Design & Modeling
• Microelectronics & Optoelectronics Packaging

Typical Research Projects:

• Low-k & Ultra-low k dielectric materials for Cu Interconnects 
• Strained Si/SiGe Materials for Micro-electronic Applications
• Organic Semiconductor Materials for Opto and Micro-electronic Devices
• Solder Alternative Technology for Fine Pitch & Environmental-Friendly IC Packaging
• Wire Bond Interconnects for Advanced Silicon Process Technologies
• Lead Free Solders for Fine Pitch Interconnects
• Design & Development of Polymeric Arrayed Waveguide Gratings (AWGs) and Packaging of Optoelectronic Transceivers
• Rare-earth materials for sub-45nm nano-electronic devices
• Fabrication and characterization of nano-structured optical interconnect devices
• Interconnect material reliability in nanoelectronics
  
  

Staff members:

• Prof Freddy Boey
• Prof Ma Jan
• Prof Subodh Mhaisalkar
• A/P Sritharan Thirumany
• A/P Chen Zhong
• A/P Wong Chee Chong
• A/P Raju Ramanujan
• Asst/P Gan Chee Lip
• A/P Lee Pooi See
• A/P Alfred Tok
• Dr Romanato Filippo